Does placing a small via under SMT components cause problems?

What I'm worried about is going to manufacture and finding out that the surface mount components with the via underneath them (0603 sized resistors for example) have not been soldered properly due to thermal issues during the reflow process. I want to avoid billboarding / tombstoning or any other unwanted thermal related issues. The vias I have are 0.5mm in diameter with a hole size of 0.25mm and they connect to one pad of the component they are under. Does anyone know if this will cause problems?